The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Oct. 20, 2016
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Taiji Sakai, Yokohama, JP;

Seiki Sakuyama, Yamato, JP;

Nobuhiro Imaizumi, Atsugi, JP;

Aki Dote, Isehara, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/40 (2006.01); H01L 23/40 (2006.01); H01L 25/04 (2014.01); H01L 25/065 (2006.01); H01L 25/075 (2006.01); H01L 25/11 (2006.01); H01L 23/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4012 (2013.01); H01L 23/562 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 24/98 (2013.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 25/0756 (2013.01); H01L 25/117 (2013.01); H05K 1/00 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/034 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14134 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17134 (2013.01); H01L 2224/17177 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.


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