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EPO Patents = 1

Trademarks = 2

Forward Citations = 2

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15 inventors (with patents filed for the assignee):

Toshiki Iwai (3 out of 3 patents)

Daisuke Mizutani (3 out of 32 patents)

Taiji Sakai (2 out of 19 patents)

4. Masaharu Furuyama (1 out of 3 patents)

5. Tomoyuki Akahoshi (1 out of 12 patents)

6. Masateru Koide (1 out of 22 patents)

7. Manabu Watanabe (1 out of 35 patents)

8. Seigo Yamawaki (1 out of 8 patents)

9. Kei Fukui (1 out of 7 patents)

10. Seiki Sakuyama (1 out of 47 patents)

11. Hiroshi Nakano (1 out of 1 patent)

12. Norikazu Ozaki (1 out of 1 patent)

13. Norikazu Ozaki (0 patent)

14. Satoru Hasegawa (0 patent)

15. Hiroshi Miyao (0 patent)

5 patents: Sort by Forward Citations

1. 12114433 - Substrate, method for manufacturing substrate, and electronic device (2024-10-08),

2. 11317520 - Circuit board, method of manufacturing circuit board, and electronic device (2022-04-26),

3. 11152291 - Multilayer substrate (2021-10-19),

4. 11057996 - Circuit board, method of manufacturing circuit board, and electronic device (2021-07-06),

5. 10770386 - Wiring board, electronic device, and wiring board manufacturing method (2020-09-08),

Fujitsu Interconnect Technologies Limited (FIT) is a leading provider of advanced interconnect technology solutions for the semiconductor packaging, communications, automotive and industrial sectors. FIT offers a wide range of interconnect products including advanced multi-chip modules, high-performance sockets, flexible printed circuit boards, and high-speed connectors. With a strong commitment to innovation and quality, FIT is dedicated to providing cutting-edge interconnect solutions to meet the evolving needs of the industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

5 Patents

#68 in Nagano

#6,485 in Japan

Nagano, Japan

Fujitsu Interconnect Technologies Limited