The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Oct. 24, 2019
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventors:

Toshiki Iwai, Atsugi, JP;

Taiji Sakai, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/15 (2013.01); H01L 23/49894 (2013.01);
Abstract

A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.


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