The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
May. 26, 2020
Fujitsu Interconnect Technologies Limited, Nagano, JP;
Hiroshi Nakano, Nagano, JP;
Norikazu Ozaki, Nagano, JP;
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED, Nagano, JP;
Abstract
A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material () having a penetrating hole (B) in the thickness direction and includes a second base material () fitted into the penetrating hole (B). The second base material () includes multiple metal bodies (B). The metal bodies (B) penetrate in the thickness direction of the first base material () in a state of having an end exposed at each of a first surface and a second surface of the second base material () that face each other in the thickness direction.