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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831210 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Nov. 28, 2016

Electronic device and electronic apparatus

Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Taiki Uemura, Kawasaki, JP;

Seiki Sakuyama, Yamato, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:

Fujitsu Patent Center

Primary Examiner:

Hsien Ming Lee

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 28/00 (2006.01); C22C 9/02 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 9/02 (2013.01); C22C 13/00 (2013.01); C22C 28/00 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01);
Abstract

An electronic device includes an electrode including Cu, a solder including Sn and provided above the electrode, and a joining layer including In and Ag and provided along a boundary between the electrode and the solder. The joining layer including In and Ag prevents Cu—Sn alloy, such as CuSn, from being formed at the boundary between the electrode and the solder, and prevents generation of voids and cracks resulting from the Cu—Sn alloy. The electrode and the solder are joined with sufficient strength by the joining layer.

Find Patent Forward Citations

Uemura, Taiki. (2017). Electronic device and electronic apparatus (U.S. Patent No. 9831210). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9831210

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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