The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Nov. 04, 2014
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Kozo Shimizu, Atsugi, JP;

Seiki Sakuyama, Isehara, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); B23K 1/0016 (2013.01); B23K 3/085 (2013.01); H01L 23/3675 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H05K 3/3463 (2013.01); B23K 2001/12 (2013.01); H01L 23/145 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 24/13 (2013.01); H01L 24/20 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16505 (2013.01); H01L 2224/16507 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/759 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75501 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81948 (2013.01); H01L 2224/81986 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/35121 (2013.01); H05K 1/0203 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0248 (2013.01); H05K 2201/09972 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/1121 (2013.01); H05K 2203/304 (2013.01);
Abstract

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.


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