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For the Inventor, By the Inventor

San Jose, CA, United States of America

Satya N Chillara

This inventor holds 11 USPTO granted patents. Top assignee: National Semiconductor Corporation. Active years: 1995-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satya N Chillara. Retrieved from https://idiyas.com/inventor/satya-n-chillara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 11

Forward Citations = 510(Granted Patents)


Company Filing History:

goldMedal11 out of 4,791 
 
National Semiconductor Corporation
 patents

Years Active: 1995-2001

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11 patents (USPTO):Explore Patents
1. 6184575 - Ultra-thin composite package for integrated circuits (2001-02-06),
2. 5790378 - High density integrated circuit package including interposer (1998-08-04),
3. 5739581 - High density integrated circuit package assembly with a heatsink between (1998-04-14),
4. 5705851 - Thermal ball lead integrated package (1998-01-06),
5. 5650659 - Semiconductor component package assembly including an integral RF/EMI (1997-07-22),
6. 5648679 - Tape ball lead integrated circuit package (1997-07-15),
7. 5627405 - Integrated circuit assembly incorporating an anisotropic elecctrically (1997-05-06),
8. 5569956 - Interposer connecting leadframe and integrated circuit (1996-10-29),
9. 5569955 - High density integrated circuit assembly combining leadframe leads with (1996-10-29),
10. 5498901 - Lead frame having layered conductive planes (1996-03-12),
11. 5442230 - High density integrated circuit assembly combining leadframe leads with (1995-08-15),

Title: Innovations of Satya N Chillara

Introduction

Satya N Chillara is a prominent inventor based in San Jose, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 11 patents. His work has advanced the technology used in electronic devices, making them more efficient and compact.

Latest Patents

One of his latest patents is for an ultra-thin composite package for integrated circuits. This innovative package includes a metal base with a cavity to support a die, along with a molded plastic cap that encapsulates the die. The design allows for package thicknesses of about 20 mils (0.5 mm) or less, which is a remarkable achievement in reducing the size of electronic components. Another notable patent is for a high-density integrated circuit package that includes an interposer. This package features a first lead frame attached to the top surface of a substrate, with a second lead frame on the bottom surface. This configuration results in a package with significantly greater lead density compared to traditional designs.

Career Highlights

Satya N Chillara has been instrumental in the development of advanced packaging solutions at National Semiconductor Corporation. His expertise in integrated circuit technology has positioned him as a leader in the industry. His innovative designs have not only improved the performance of electronic devices but have also contributed to the miniaturization of technology.

Collaborations

Throughout his career, Satya has collaborated with several talented individuals, including Shahram Mostafazadeh and Jagdish G Belani. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in the field.

Conclusion

Satya N Chillara's contributions to integrated circuit packaging have had a lasting impact on the electronics industry. His innovative patents and collaborative efforts continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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