The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1998
Filed:
Jun. 28, 1995
Shahram Mostafazadeh, San Jose, CA (US);
Satya Chillara, San Jose, CA (US);
Jagdish G Belani, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A Thermal Ball Lead Integrated Package (Thermal BLIP) having improved thermal performance over prior art BLIPs is described. The BLIP combines ball and lead technologies to increase the interconnect density of the package but has relatively poor heat extraction capabilities. The Thermal BLIP is particularly well suited for high power and pin count integrated circuit devices. In an embodiment of the present invention, a heat sink is attached to the top surface of the die and extends through the package molding such that it is exposed to the ambient environment. Since the heat sink is integrated into the molding, the package size and footprint is not increased thereby limiting the cost increase of the package. This arrangement enables the use of high power devices in dense circuit board applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile