The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1998
Filed:
Nov. 17, 1995
Applicant:
Inventors:
Satya Chillara, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257668 ; 257675 ; 257706 ; 257724 ; 257738 ;
Abstract
An integrated circuit package assembly with a first die disposed over a first substrate having traces defined therein to provide electrical access to the first die. A heatsink is disposed over the substrate and the first die. A second die and a leadframe is disposed over the heatsink. The leadframe provides electrical access to the second die.
Chillara, Satya. (1998). High density integrated circuit package assembly with a heatsink between (U.S. Patent No. 5739581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5739581
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile