Tape ball lead integrated circuit package

Abstract

An integrated circuit assembly includes a dielectric flex tape substrate defining a predetermined array of electrically conductive traces and an array of solder balls or solder columns electrically connected to the bottom surface of the flex tape substrate and the traces. An integrated circuit die having a series of input/output pads is supported on the substrate. In one embodiment, a plurality of electrically conductive leads are supported by the flex tape substrate in electrical isolation from and over the conductive traces. A first and second series of bonding wires electrically connect certain ones of the input/output terminals on the integrated circuit die to the electrically conductive leads and conductive traces, respectively. In other embodiments, one or more electrically isolated conductive layers are supported by the dielectric flex tape substrate over the traces and electrically conductive leads. The integrated circuit package assembly, in accordance with any of these embodiments, provides a very high density electrical interconnection arrangement for the integrated circuit die while retaining a small package footprint.