The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Aug. 26, 1994
Applicant:
Inventors:
Satya Chillara, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
An ultra-thin composite package for integrated circuits including a metal base with a cavity to support a die with a molded plastic cap cooperating with the base to encapsulate the die. A lead frame having a thinned inner portion or lead tip areas may also be used to further reduce the package thickness. Package thicknesses of about 20 mils (0.5 mm) or less can be readily achieved using this structure combination.
Quick Actions:
Chillara, Satya. (2001). Ultra-thin composite package for integrated circuits (U.S. Patent No. 6184575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6184575
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile