Location History:
- Okayama, JP (2016 - 2021)
- Kanagawa, JP (2023)
- Tokyo, JP (2016 - 2024)
Company Filing History:
10 out of 315 
2 out of 77 
1 out of 28,577 
Years Active: 2016-2024
Title: Satoru Kurita: Innovator in Bonding Materials
Introduction
Satoru Kurita, based in Okayama, Japan, is a prominent inventor with a significant portfolio of 12 patents. His innovative contributions primarily focus on advanced bonding materials that have enhanced applications in electronics and other industries.
Latest Patents
Among his most recent inventions, Kurita has developed a sophisticated bonding material and method designed to improve the performance of metal pastes. His first patent details a bonding material that incorporates metal particles of varying sizes, specifically tailored to optimize bonding strength and reduce defects. The composition includes first metal particles measuring 1 to 40 nm, second metal particles ranging from 41 to 110 nm, and third particles sized from 120 nm to 10 μm. The specific weight percentages of these particles ensure effective bonding capabilities.
Additionally, Kurita's second patent introduces an innovative joining material that effectively prevents void formation in silver bonding layers. By utilizing a special solvent combination and fine silver particles, the material addresses challenges related to bubble entrapment during the coating process, thereby enhancing the reliability of electronic components.
Career Highlights
Kurita has made significant strides in his career with notable contributions while working at companies such as Dowa Electronics Materials Co., Ltd. and Dowa Metaltech Co., Ltd. These roles have allowed him to push the boundaries of material science and electronics manufacturing.
Collaborations
Throughout his career, Satoru Kurita has collaborated with esteemed colleagues such as Keiichi Endoh and Hiromasa Miyoshi. Their joint efforts have fostered innovation and furthered developments in bonding technology.
Conclusion
Satoru Kurita's work exemplifies the spirit of innovation in the field of bonding materials. With his extensive patent portfolio and collaborative efforts, he continues to influence advancements in technology, paving the way for more reliable and efficient electronic devices.