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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10821558 B1

PDFFull Text
Date of Patent:
Nov. 03, 2020

Filed:

Aug. 31, 2015

Bonding material and bonding method using same

Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Keiichi Endoh, Okayama, JP;

Hiromasa Miyoshi, Okayama, JP;

Kimikazu Motomura, Okayama, JP;

Satoru Kurita, Okayama, JP;

Assignee:

DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;

Attorneys:

Bachman and LaPointe PC

George Coury

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/30 (2006.01); B23K 1/19 (2006.01); B23K 1/008 (2006.01); B23K 5/00 (2006.01); C22C 9/00 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B22F 1/00 (2006.01); H01L 23/00 (2006.01); B22F 9/24 (2006.01); B23K 20/233 (2006.01); B22F 7/00 (2006.01); B22F 9/02 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01); H01B 1/22 (2006.01); B22F 7/06 (2006.01); B23K 103/12 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/302 (2013.01); B22F 1/0011 (2013.01); B22F 1/0059 (2013.01); B22F 7/008 (2013.01); B22F 9/02 (2013.01); B22F 9/24 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 5/00 (2013.01); B23K 20/026 (2013.01); B23K 20/16 (2013.01); B23K 20/233 (2013.01); B23K 35/025 (2013.01); B23K 35/36 (2013.01); C22C 9/00 (2013.01); H01B 1/22 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 7/062 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); H01L 2224/27848 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83204 (2013.01);
Abstract

There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 μm, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.

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