Okayama, Japan

Keiichi Endoh

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 16(Granted Patents)


Location History:

  • Okayama, JP (2014 - 2021)
  • Tokyo, JP (2016 - 2024)

Company Filing History:


Years Active: 2014-2024

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14 patents (USPTO):Explore Patents

Title: **Keiichi Endoh: Innovating Bonding Materials in Okayama, Japan**

Introduction

Keiichi Endoh is a prominent inventor based in Okayama, Japan, recognized for his significant contributions in the field of bonding materials. With a portfolio of 14 patents, Endoh has established himself as a key innovator. His work primarily focuses on the development of advanced bonding materials that can enhance manufacturing processes.

Latest Patents

Endoh's latest patents illustrate his innovative approach and technical expertise. One of his notable inventions is a **Bonding Material and Bonding Method Using Same**, which involves a metal paste containing varying sizes of metal particles. This invention ensures optimal weight percentages among different metal particles, resulting in better performance in bonding applications.

Another significant patent is the **Joining Material and Joining Method Using Same**, which addresses the challenges of preventing voids in silver bonding layers. This material is designed to prevent bubble entrapment during the coating film formation, thereby enhancing the reliability of the bonding method.

Career Highlights

Throughout his career, Keiichi Endoh has contributed extensively to the field of materials science. His innovative spirit is evident in his work with Dowa Electronics Materials Co., Ltd., where he continues to drive advancements in bonding technologies. His patents reflect a commitment to solving complex engineering issues, positioning him as a leader in his industry.

Collaborations

Keiichi Endoh's collaborations with fellow researchers and inventors, including Satoru Kurita and Yutaka Hisaeda, have further propelled his innovative work. These partnerships foster a creative environment that encourages the sharing of ideas and technologies, enhancing the scope of their collective research.

Conclusion

In conclusion, Keiichi Endoh stands out as a vital contributor to the world of innovations in bonding materials. His impressive patent portfolio not only highlights his inventive prowess but also signifies the potential for improved manufacturing processes in various industries. With a strong foundation built on collaboration and creativity, Endoh's work will likely continue to influence the field for years to come.

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