The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Dec. 11, 2015
Applicant:
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Inventors:
Keiichi Endoh, Okayama, JP;
Yutaka Hisaeda, Nuremberg, DE;
Akihiro Miyazawa, Okayama, JP;
Aiko Hirata, Saitama, JP;
Toshihiko Ueyama, Okayama, JP;
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 11/06 (2006.01); B22F 1/00 (2006.01); B82Y 30/00 (2011.01); H01B 1/02 (2006.01); H05K 3/32 (2006.01); B22F 7/06 (2006.01); B22F 9/24 (2006.01); C22C 5/06 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 1/0014 (2013.01); B22F 1/0018 (2013.01); B22F 1/0062 (2013.01); B22F 7/064 (2013.01); B22F 9/24 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/36 (2013.01); B23K 35/3618 (2013.01); B82Y 30/00 (2013.01); C09J 11/06 (2013.01); C22C 5/06 (2013.01); H01B 1/02 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H05K 3/32 (2013.01); B22F 2301/255 (2013.01); B22F 2303/01 (2013.01); B22F 2304/054 (2013.01); B22F 2304/056 (2013.01); B22F 2999/00 (2013.01); B23K 2201/42 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13033 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/203 (2013.01); H01L 2924/2011 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H01L 2924/20108 (2013.01); H01L 2924/20109 (2013.01); H01L 2924/20111 (2013.01); H05K 3/3489 (2013.01); H05K 2201/0257 (2013.01); H05K 2203/086 (2013.01); H05K 2203/1131 (2013.01);
Abstract
A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.