Okayama, Japan

Yutaka Hisaeda

USPTO Granted Patents = 12 

 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 19(Granted Patents)


Location History:

  • Honjo, JP (2012)
  • Okayama, JP (2012 - 2016)
  • Tokyo, JP (2016)
  • Nuremberg, DE (2017 - 2018)

Company Filing History:


Years Active: 2012-2018

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12 patents (USPTO):Explore Patents

Title: Yutaka Hisaeda: Innovator in Bonding Technologies

Introduction

Yutaka Hisaeda is a prominent inventor based in Okayama, Japan. He has made significant contributions to the field of bonding technologies, holding a total of 12 patents. His innovative approaches have paved the way for advancements in materials science and engineering.

Latest Patents

Hisaeda's latest patents include a bonding method using a bonding material. This method involves applying a bonding material containing a flux component with an organic material that has at least two carboxyl groups to a bonding surface. The process includes disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature, and conducting a main firing at a higher temperature. Another notable patent is for a bonding material and bonding method that utilizes a silver paste containing silver nanoparticles. This method results in a bonded product with specific crystallite diameters when heated in an inert atmosphere.

Career Highlights

Yutaka Hisaeda has been instrumental in the development of innovative bonding techniques at Dowa Electronics Materials Co., Ltd. His work has not only advanced the company's capabilities but has also contributed to the broader field of electronics and materials engineering.

Collaborations

Hisaeda has collaborated with notable colleagues such as Toshihiko Ueyama and Keiichi Endoh. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Yutaka Hisaeda's contributions to bonding technologies exemplify the impact of innovative thinking in materials science. His patents and collaborative efforts continue to influence the industry and inspire future advancements.

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