The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
May. 13, 2011
Satoru Kurita, Tokyo, JP;
Keiichi Endoh, Tokyo, JP;
Yu Saito, Tokyo, JP;
Yutaka Hisaeda, Tokyo, JP;
Toshihiko Ueyama, Tokyo, JP;
Satoru Kurita, Tokyo, JP;
Keiichi Endoh, Tokyo, JP;
Yu Saito, Tokyo, JP;
Yutaka Hisaeda, Tokyo, JP;
Toshihiko Ueyama, Tokyo, JP;
DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;
Abstract
There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 μm or more and 10 μm or less, and an organic material having two or more carboxyl groups.