The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Dec. 11, 2015
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Keiichi Endoh, Okayama, JP;

Yutaka Hisaeda, Nuremberg, DE;

Akihiro Miyazawa, Okayama, JP;

Aiko Hirata, Saitama, JP;

Toshihiko Ueyama, Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/20 (2006.01); H05K 3/32 (2006.01); C09J 11/06 (2006.01); B22F 1/00 (2006.01); B82Y 30/00 (2011.01); H01B 1/02 (2006.01); B22F 7/06 (2006.01); B22F 9/24 (2006.01); C22C 5/06 (2006.01); B23K 1/00 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 1/0014 (2013.01); B22F 1/0018 (2013.01); B22F 1/0062 (2013.01); B22F 7/064 (2013.01); B22F 9/24 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/36 (2013.01); B23K 35/3618 (2013.01); B82Y 30/00 (2013.01); C09J 11/06 (2013.01); C22C 5/06 (2013.01); H01B 1/02 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H05K 3/32 (2013.01); B22F 2301/255 (2013.01); B22F 2303/01 (2013.01); B22F 2304/054 (2013.01); B22F 2304/056 (2013.01); B22F 2999/00 (2013.01); B23K 2201/42 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13033 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/203 (2013.01); H01L 2924/2011 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H01L 2924/20108 (2013.01); H01L 2924/20109 (2013.01); H01L 2924/20111 (2013.01); H05K 3/3489 (2013.01); H05K 2201/0257 (2013.01); H05K 2203/086 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.


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