Akihiro Miyazawa

Title: Akihiro Miyazawa: Innovator in Bonding Materials

Introduction

Akihiro Miyazawa is a prominent inventor based in Okayama, Japan. He has made significant contributions to the field of bonding materials, holding a total of 5 patents. His innovative work focuses on enhancing the efficiency and effectiveness of bonding methods used in various applications.

Latest Patents

Miyazawa's latest patents include a bonding material and a bonding method utilizing this material. The bonding material consists of a silver paste that incorporates fine silver particles with an average primary particle diameter of 1 to 50 nanometers, each coated with an organic compound. Additionally, it contains silver particles with an average primary particle diameter of 0.5 to 4 micrometers, also coated with an organic compound. The formulation includes a solvent, dispersants, and a sintering aid, ensuring that the total content of silver particles is not less than 90% by weight. The bonding method involves applying this material to a bonding surface, followed by a two-step firing process to achieve optimal bonding between different substances.

Career Highlights

Miyazawa is currently employed at Dowa Electronics Materials Co., Ltd., where he continues to develop innovative bonding solutions. His work has been instrumental in advancing the technology used in electronic materials and bonding applications.

Collaborations

Throughout his career, Miyazawa has collaborated with notable colleagues, including Keiichi Endoh and Yutaka Hisaeda. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Akihiro Miyazawa's contributions to the field of bonding materials demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and its applications in technology.