The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Jun. 10, 2011
Keiichi Endoh, Okayama, JP;
Yutaka Hisaeda, Okayama, JP;
Akihiro Miyazawa, Okayama, JP;
Aiko Nagahara, Okayama, JP;
Toshihiko Ueyama, Okayama, JP;
Keiichi Endoh, Okayama, JP;
Yutaka Hisaeda, Okayama, JP;
Akihiro Miyazawa, Okayama, JP;
Aiko Nagahara, Okayama, JP;
Toshihiko Ueyama, Okayama, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.