Okayama, Japan

Aiko Nagahara

This inventor holds 3 USPTO granted patents and 2 EPO patents. Top assignee: Dowa Electronics Materials Co., Ltd.. Active years: 2014-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Aiko Nagahara. Retrieved from https://idiyas.com/inventor/aiko-nagahara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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3 patents (USPTO):Explore Patents

Title: Aiko Nagahara: Innovator in Bonding Materials

Introduction

Aiko Nagahara is a prominent inventor based in Okayama, Japan. She has made significant contributions to the field of bonding materials, particularly through her innovative use of metal nanoparticles. With a total of 3 patents, her work has garnered attention for its practical applications in various industries.

Latest Patents

Aiko's latest patents focus on advanced bonding materials and methods. One notable invention is a bonding material and bonding method using metal nanoparticles. This method involves a paste containing a flux component that can form a metal phase even in an inert atmosphere. The paste allows for bonding at low temperatures without the need for conventional pressurization, making it suitable for use in environments such as nitrogen atmospheres. The bonding material includes silver nanoparticles with an average primary particle diameter of 1 to 200 nm, coated with an organic material having 8 or fewer carbon atoms, along with a flux component and a dispersion medium. This innovation enables bonding at temperatures of 300°C or lower.

Another patent involves a bonding material using metal nanoparticles coated with C6-C8 fatty acids. This invention addresses the challenge of uniformly mixing nanoparticles with microparticles. Aiko's solution includes a bonding material with metal nanoparticles having an average particle diameter of 100 nm or less, coated with an organic substance, and a polar solvent. The bonding process occurs at temperatures between 200 to 350°C under pressure, allowing for the formation of a bonding layer of bulk material at low temperatures.

Career Highlights

Aiko Nagahara is currently employed at Dowa Electronics Materials Co., Ltd. Her work at this company has been instrumental in advancing the field of bonding materials. She has developed innovative solutions that enhance the performance and applicability of bonding technologies.

Collaborations

Aiko has collaborated with notable colleagues, including Yutaka Hisaeda and Toshihiko Ueyama. These partnerships have contributed to her success and the development of her groundbreaking inventions.

Conclusion

Aiko Nagahara is a trailblazer in the field of bonding materials, with her innovative patents paving the way for advancements in technology. Her contributions are significant and continue to impact various industries positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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