The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Sep. 27, 2017
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Keiichi Endoh, Tokyo, JP;
Minami Kanasugi, Tokyo, JP;
Hideyuki Fujimoto, Tokyo, JP;
Satoru Kurita, Tokyo, JP;
DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;
Abstract
In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles having an average primary particle diameter of 1 to 40 nm, second metal particles having an average primary particle diameter of 41 to 110 nm, and third metal particles having an average primary particle diameter of 120 nm to 10 μm, the weight percentages of the first, second and third metal particles being 1.4 to 49% by weight, 36% by weight or less, and 50 to 95% by weight, respectively, with respect to the total 100% by weight of the metal particles, and the weight ratio of the first metal particles to the second metal particles being 14/36 or more.