The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Sep. 02, 2014
Dowa Metaltech Co., Ltd., Tokyo, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Abstract
In a method for producing an electronic part mounting substrate wherein an electronic partis mounted on one major surface (a surface to which the electronic partis to be bonded) of the metal plateof copper, or aluminum or the aluminum alloy (when a plating filmof copper is formed on the surface), the one major surface of the metal plate(or the surface of the plating filmof copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating filmof copper) to arrange the electronic partthereon to sinter silver in the silver paste to form a silver bonding layerto bond the electronic partto the one major surface of the metal plate(or the surface of the plating filmof copper) with the silver bonding layer