The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Nov. 22, 2013
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Naoya Sunachi, Akita, JP;

Hideyo Osanai, Nagano, JP;

Satoru Kurita, Okayama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/22 (2006.01); H01L 21/48 (2006.01); B23K 35/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); B23K 35/001 (2013.01); B23K 35/22 (2013.01); Y10T 428/12472 (2015.01);
Abstract

An electronic part mounting substrate includes: a metal plate(for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal platebeing surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating filmof nickel or a nickel alloy formed on the one major surface of the metal plate; an electronic partbonded to the plating filmby a silver bonding layer(containing a sintered body of silver); a ceramic substratehaving a substantially rectangular planar shape, one major surface of the ceramic substratebeing bonded to the other major surface of the metal plate; and a radiating metal plate (metal base plate)bonded to the other major surface of the ceramic substrate


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