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Ryugo Oba

USPTO Granted Patents = 13 (Patent Applications = 1)

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 158(Granted Patents)

Location History:

Ota-Ku, JP (2011)
Tokyo, JP (2007 - 2020)

Company Filing History:

13 out of 1,552

Disco Corporation

Years Active: 2007-2020

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10811458 - Method of processing wafer (2020-10-20),

2. 10109527 - Optical device wafer processing method (2018-10-23),

3. 9724783 - Laser processing apparatus (2017-08-08),

4. 8610030 - Laser beam processing machine (2013-12-17),

5. 8049133 - Laser beam machining apparatus (2011-11-01),

6. 7968821 - Laser processing beam machine (2011-06-28),

7. 7897488 - Dividing method for wafer having film on the front side thereof (2011-03-01),

8. 7772092 - Wafer processing method (2010-08-10),

9. 7655541 - Wafer processing method and laser processing apparatus (2010-02-02),

10. 7601616 - Wafer laser processing method (2009-10-13),

11. 7482554 - Laser beam processing machine (2009-01-27),

12. 7396780 - Method for laser processing of wafer (2008-07-08),

13. 7179723 - Wafer processing method (2007-02-20),

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