Location History:
- Ota-Ku, JP (2011)
- Tokyo, JP (2007 - 2020)
Company Filing History:
Years Active: 2007-2020
Title: The Innovative Contributions of Ryugo Oba
Introduction
Ryugo Oba is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 13 patents. His work has advanced the technology used in optical devices and semiconductor manufacturing.
Latest Patents
One of his latest patents is a method of processing a wafer that involves a unique approach to forming grooves along projected dicing lines. This method includes a mask layer forming step, a plasma etching step, and a mask layer removing step. Another notable patent is the optical device wafer processing method, which utilizes a pulsed laser beam to create shield tunnels in a sapphire substrate. This innovative technique allows for the division of optical device wafers into individual chips.
Career Highlights
Ryugo Oba is currently employed at Disco Corporation, where he continues to develop cutting-edge technologies in wafer processing. His expertise has positioned him as a key figure in the industry, contributing to advancements that enhance the efficiency and effectiveness of optical devices.
Collaborations
Throughout his career, Ryugo has collaborated with notable colleagues such as Kenji Furuta and Hiroshi Morikazu. These partnerships have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Ryugo Oba's contributions to the field of wafer processing are invaluable. His innovative patents and collaborative efforts continue to shape the future of optical devices and semiconductor technology.