The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Oct. 31, 2005
Hitoshi Hoshino, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Kenji Furuta, Tokyo, JP;
Noburu Takeda, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Hitoshi Hoshino, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Kenji Furuta, Tokyo, JP;
Noburu Takeda, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.