The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Nov. 12, 2004
Applicants:
Satoshi Genda, Tokyo, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Kenji Furuta, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Inventors:
Satoshi Genda, Tokyo, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Kenji Furuta, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.