The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Jul. 19, 2007
Hiroshi Morikazu, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Yukio Morishige, Tokyo, JP;
Toshio Tsuchiya, Tokyo, JP;
Koji Yamaguchi, Tokyo, JP;
Hiroshi Morikazu, Tokyo, JP;
Ryugo Oba, Tokyo, JP;
Yukio Morishige, Tokyo, JP;
Toshio Tsuchiya, Tokyo, JP;
Koji Yamaguchi, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.