Kodaira, Japan

Ryo Haruta


Average Co-Inventor Count = 5.2

ph-index = 10

Forward Citations = 349(Granted Patents)


Location History:

  • Fuchu, JP (1992)
  • Kokubunji, JP (1986 - 1994)
  • Kodaira, JP (2000 - 2005)
  • Takasaki, JP (2005)

Company Filing History:


Years Active: 1986-2005

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23 patents (USPTO):Explore Patents

Title: Ryo Haruta: Innovator in Semiconductor Technology

Introduction

Ryo Haruta, based in Kodaira, Japan, is a prominent inventor with a remarkable portfolio of 23 patents. His significant contributions to the field of semiconductor technology have shown innovative approaches to enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

Haruta's latest inventions include a highly reliable semiconductor device designed to prevent junction failures between pads and wires, as well as pads peeling off their underlying insulating layers. This invention incorporates plugs that are strategically formed within electrode pads on a substrate, enhancing durability. Another noteworthy patent focuses on a method for manufacturing a ball grid array type semiconductor package, which includes the innovative use of a divided insulation layer that prevents short circuits between the semiconductor chip and the electric conductor layer pattern. This method further reduces substrate deformation by ensuring the insulation layer is formed in a way that accommodates flexible film substrates.

Career Highlights

Throughout his career, Ryo Haruta has made substantial contributions while working with esteemed companies, including Hitachi, Ltd. His expertise in semiconductor technology has played a critical role in advancing the industry's standards and reliability.

Collaborations

Haruta has collaborated with notable colleagues in the field, such as Masahiro Ichitani and Atsushi Fujisawa. These partnerships have contributed to the development of innovative solutions and advancements in semiconductor devices and manufacturing processes.

Conclusion

Ryo Haruta continues to be a significant figure in the semiconductor industry, with a focus on creating efficient and reliable devices. His extensive patent portfolio and collaborative efforts exemplify his commitment to innovation and excellence in the field. As technology progresses, the impact of his work will likely resonate throughout the industry for years to come.

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