Hitachi, Ltd.

Other

Renesas Technology Corp.

Hitachi Hokkai Semiconductor Ltd.

Hitachi Microcomputer System, Ltd.

Ryo Haruta

Masahiro Ichitani

Atsushi Fujisawa

Takafumi Konno

Shingo Ohsaka

Akihiro Yaguchi

Katsuyuki Matsumoto

Naotaka Tanaka

Ichiro Anjo

Ryosuke Kimoto

Junichi Arita

Masanori Shibamoto

Hiroshi Koyama

Hisao Nakamura

Seiichi Ichihara

Hiroshi Kawakubo

Asao Nishimura

Makoto Kitano

Ichiro Anjoh

Junichi Saeki

Takeshi Terasaki

Iwao Takemoto

Takashi Nakajima

Shinichiro Kimura

Masayuki Suzuki

Makoto Ohkura

Masashi Sahara

Masanobu Miyao

Shigeyuki Hosoki

Shigeru Nishimatsu

Tatsumi Mizutani

Kiichiro Mukai

Terunori Warabisako

Chusuke Munakata

Kanji Tsujii

Takashi Tokuyama

Tomoo Matsuzawa

Yasushiro Nishioka

Hiroshi Shinriki

Ken Okutani

Yasuyuki Nakajima

Masayuki Nakata

Tsutomu Kakimoto

Arata Kinjyo

A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.

Semiconductor device and method of manufacturing same

In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

Method of manufacturing semiconductor package including forming a resin sealing member

A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

Semiconductor device and lead frame therefor

In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate

Method of manufacturing semiconductor device having resin sealing body

A semiconductor device in which a semiconductor chip is bonded by a metal bond to one surface of a heat sink formed of a material with a thermal expansion coefficient is close to he semiconductor chip the heat sink is glued to a stiffener with a silicon adhesive with an elastic modulus of 10 MPa or less, a TAB tape is glued to the stiffener with an epoxy adhesive and the semiconductor chip is sealed with an epoxy sealing resin with an elastic modulus of 10 GPa or more for protection from outside.

Semiconductor device and mounting board

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device

In a ball grid array type semiconductor device mounted on a printed wiring board, the external terminals can be prevented from being broken down even when the ambient temperature on the device is repeatedly changed. A flexible adhesive member for gluing the semiconductor chip to an insulating tape is provided to cover up to a region including the lands to which the external terminals are bonded and which are provided on the insulating tape surface. The flexible adhesive member for covering the lands may be replaced by a flexible low-elasticity member.

The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads are arranged on one side opposite to the side on which bonding pads (effective pins) are arranged in the semiconductor chip. Dummy leads are formed on an insulating tape The semiconductor chip is supported with inner lead portions connected to the corresponding bonding pads and the inner lead portions of the dummy leads connected to the corresponding dummy pads

Semiconductor device and process for producing the same

A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bond ed to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

Method of manufacturing a semiconductor device

A semiconductor device in which a semiconductor chip is bonded by a metal bond to one surface of a heat sink formed of a material with a thermal expansion coefficient is close to the semiconductor chip , the heat sink is glued to a stiffener with a silicon adhesive with an elastic modulus of 10 MPa or less, a TAB tape is glued to the stiffener with an epoxy adhesive , and the semiconductor chip is sealed with an epoxy sealing resin with an elastic modulus of 10 GPa or more for protection from outside.

Semiconductor device, manufacturing method thereof and mounting board

Growing community of inventors

Kodaira, Japan

Ryo Haruta