The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
May. 26, 1998
Applicant:
Inventors:
Masanori Shibamoto, Urawa, JP;
Masahiro Ichitani, Kodaira, JP;
Ryo Haruta, Kodaira, JP;
Katsuyuki Matsumoto, Hitachi, JP;
Junichi Arita, Musashimurayama, JP;
Ichiro Anjo, Koganei, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract
A semiconductor device in which a semiconductor chip is bonded by a metal bond to one surface of a heat sink formed of a material with a thermal expansion coefficient is close to the semiconductor chip , the heat sink is glued to a stiffener with a silicon adhesive with an elastic modulus of 10 MPa or less, a TAB tape is glued to the stiffener with an epoxy adhesive , and the semiconductor chip is sealed with an epoxy sealing resin with an elastic modulus of 10 GPa or more for protection from outside.