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Hokkaido, Japan

Hitachi Hokkai Semiconductor Ltd.

USPTO Granted Patents = 26

% Expired Patents = 61.5

Forward Citations = 263

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83 inventors (with patents filed for the assignee):

Naoki Yada (5 out of 28 patents)

Tadatoshi Danno (4 out of 52 patents)

Hajime Hasebe (4 out of 20 patents)

4. Yukihiro Satou (4 out of 37 patents)

5. Eiichi Ishikawa (4 out of 19 patents)

6. Atsushi Fujisawa (4 out of 15 patents)

7. Takafumi Konno (4 out of 14 patents)

8. Masahiro Ichitani (3 out of 52 patents)

9. Shingo Ohsaka (3 out of 8 patents)

10. Ryo Haruta (3 out of 23 patents)

11. Tsugihiko Hirano (2 out of 7 patents)

12. Osamu Takahashi (2 out of 3 patents)

13. Kunio Ogasawara (2 out of 3 patents)

14. Shigeru Nakamura (2 out of 4 patents)

15. Norihiko Kasai (2 out of 4 patents)

Core Competencies:

Semiconductor Device

Microcomputer

Integrated Circuit

Fabrication Method

Memory Device

Sealing Member

Ball Grid Array

Data Processing

Resin Molded Package

Communication Interfacing

Testing Method

Lead Frame

26 patents: Sort by Forward Citations

1. 8618642 - Semiconductor device (2013-12-31),

2. 8044509 - Semiconductor device (2011-10-25),

3. 7911054 - Semiconductor device (2011-03-22),

4. 7805562 - Microcomputer with configurable communication interfacing (2010-09-28),

5. 7518156 - Semiconductor device (2009-04-14),

6. 7310700 - Microcomputer, programming method and erasing method (2007-12-18),

7. 7277979 - Microcomputer with mode-controlled memory (2007-10-02),

8. 7253011 - Fabrication method of semiconductor integrated circuit device (2007-08-07),

9. 7199469 - Semiconductor device having stacked semiconductor chips sealed with a resin seal member (2007-04-03),

10. 7194571 - Microcomputer, programming method and erasing method (2007-03-20),

11. 7093042 - Microcomputer and data processing device (2006-08-15),

12. 7015119 - Fabrication method of semiconductor integrated circuit device (2006-03-21),

13. 7015070 - Electronic device and a method of manufacturing the same (2006-03-21),

14. 6974710 - Fabrication method of semiconductor integrated circuit device and testing method (2005-12-13),

15. 6951774 - Semiconductor device and method of manufacturing the same (2005-10-04),

Company Overview

Hitachi Hokkai Semiconductor Ltd. specializes in the development and manufacturing of semiconductor products, focusing on advanced technologies that cater to various industries. The company is known for its expertise in producing high-performance semiconductor devices that support applications in consumer electronics, automotive systems, and industrial automation. Based in Hokkaido, Japan, Hitachi Hokkai Semiconductor plays a crucial role in the semiconductor supply chain, contributing to innovations that drive technological advancement across multiple sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

26 Patents

#4 in Hokkaido

#2,507 in Japan

#24,806 in the World

Hokkaido, Japan

Hitachi Hokkai Semiconductor Ltd.

Forward Citations = 263

83 inventors:

Naoki Yada (5 out of 28 patents)

Tadatoshi Danno (4 out of 52 patents)

Hajime Hasebe (4 out of 20 patents)

4. Yukihiro Satou (4 out of 37 patents)

5. Eiichi Ishikawa (4 out of 19 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hitachi Hokkai Semiconductor Ltd.. Retrieved from https://idiyas.com/company/hitachi-hokkai-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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