The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Sep. 28, 2001
Toru Ishida, Tama, JP;
Tetsuharu Urawa, Kodaira, JP;
Fujio Ito, Hanno, JP;
Tomoo Matsuzawa, Tokyo, JP;
Kazunari Suzuki, Tokyo, JP;
Akihiko Kameoka, Ogose, JP;
Hiromichi Suzuki, Tokyo, JP;
Takuji Ide, Higashimurayama, JP;
Toru Ishida, Tama, JP;
Tetsuharu Urawa, Kodaira, JP;
Fujio Ito, Hanno, JP;
Tomoo Matsuzawa, Tokyo, JP;
Kazunari Suzuki, Tokyo, JP;
Akihiko Kameoka, Ogose, JP;
Hiromichi Suzuki, Tokyo, JP;
Takuji Ide, Higashimurayama, JP;
Renesas Technology Corp., Tokyo, JP;
Hitachi ULSI Systems Co., Ltd., Tokyo, JP;
Hitachi Hokkai Semiconductor, Ltd., Hokkaido, JP;
Abstract
The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.