Company Filing History:
3 out of 26 
1 out of 3,781 
5 out of 832,843 Years Active: 2001-2005
Title: The Innovations of Shingo Ohsaka
Introduction
Shingo Ohsaka is a prominent inventor based in Hakodate, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on improving the manufacturing processes of semiconductor packages, which are essential components in modern electronics.
Latest Patents
One of his latest patents is a method of manufacturing a semiconductor package that includes forming a resin sealing member. In this innovative method, a semiconductor chip is mounted through an adhesive material on a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of the substrate, and the semiconductor chip is sealed by a resin. An insulation layer is formed to cover an electric conductor layer pattern on the substrate's surface. The insulation layer is divided into several parts that are mutually discontinuous in the area under the semiconductor chip. This design prevents short circuits between the semiconductor chip and the electric conductor layer pattern while suppressing deformation of the flexible film substrate.
Another notable patent by Ohsaka involves a method of manufacturing a resin-encapsulated semiconductor device that provides a vent hole in a base substrate. Similar to his previous patent, this method also involves mounting a semiconductor chip on a flexible film substrate and sealing it with resin. The insulation layer is again divided into parts to prevent short circuits and substrate deformation.
Career Highlights
Shingo Ohsaka has worked with notable companies, including Hitachi Hokkai Semiconductor Ltd. His experience in the semiconductor industry has allowed him to develop innovative solutions that enhance the reliability and performance of semiconductor devices.
Collaborations
Throughout his career, Ohsaka has collaborated with talented individuals such as Atsushi Fujisawa and Takafumi Konno. These collaborations have contributed to the advancement of semiconductor technology and the successful development of his patents.
Conclusion
Shingo Ohsaka's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the design and manufacturing of essential electronic components.