The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Jan. 09, 2003
Takashi Nakajima, Chiyoda, JP;
Naotaka Tanaka, Chiyoda, JP;
Yasuyuki Nakajima, Tachikawa, JP;
Ryo Haruta, Takasaki, JP;
Tomoo Matsuzawa, Tokyo, JP;
Masashi Sahara, Hitachinaka, JP;
Ken Okutani, Tachikawa, JP;
Takashi Nakajima, Chiyoda, JP;
Naotaka Tanaka, Chiyoda, JP;
Yasuyuki Nakajima, Tachikawa, JP;
Ryo Haruta, Takasaki, JP;
Tomoo Matsuzawa, Tokyo, JP;
Masashi Sahara, Hitachinaka, JP;
Ken Okutani, Tachikawa, JP;
Renesas Technology, Corporation, Tokyo, JP;
Abstract
A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.