Markham, Canada

Roden R Topacio

This inventor holds 38 USPTO granted patents and 11 published patent applications and 7 EPO patents, primarily in Semiconductor Packaging. Top assignees: Ati Technologies Ulc, Advanced Micro Devices Corporation. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Roden R Topacio. Retrieved from https://idiyas.com/inventor/roden-r-topacio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 38 

% Patents Active = 94.7

 

Average Co-Inventor Count = 2.1

ph-index = 7

Forward Citations = 193(Granted Patents)


Location History:

  • Ontario, CA (2015)
  • Springwater, CA (2019 - 2022)
  • Markham, CA (2010 - 2024)

Company Filing History:


Years Active: 2010-2026

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Areas of Expertise:
Semiconductor Chip
Solder Structures
Thermal Management
Underfill Anchors
Integrated Circuit
Routing Layer
Stiffener
Patterned Metallization
Die Substrate
Bump Connection
Passive Device
Adhesive
38 patents (USPTO):Explore Patents

Title: Innovations and Achievements of Roden R Topacio

Introduction

Roden R Topacio is an esteemed inventor located in Markham, Canada, renowned for his significant contributions to technology and electronics. With a remarkable portfolio of 37 patents, Topacio specializes in electronic devices and semiconductor technology, showcasing his innovative thinking and expertise in the field.

Latest Patents

Among his latest patents, Topacio has developed an electronic device that includes a substrate, a structure, and an adhesive, along with a unique process for forming the device. This invention features a substrate with a proximal surface where an electronic component, comprising at least one die, is attached. The structure is designed to have a proximal surface adjacent to the substrate, ensuring that the adhesive effectively contacts the feature on the structure or substrate. Another key patent is a semiconductor package assembly that incorporates a semiconductor chip bonded to a substrate. This assembly includes passive devices on the substrate's bottom surface, which help prevent solder bridging when mounted on a circuit board.

Career Highlights

Roden R Topacio has had an impressive career, marking his presence in well-known technology companies such as ATI Technologies and Advanced Micro Devices Corporation. His roles in these pioneering organizations have significantly influenced the scope of semiconductor and electronic device innovations, allowing him to advance his inventive endeavors.

Collaborations

Throughout his professional journey, Topacio has collaborated with notable colleagues, including Neil McLellan and Yip Seng Low. These partnerships have played a vital role in fostering innovation and driving successful projects within the high-tech industry.

Conclusion

Roden R Topacio’s continuous contributions to the fields of electronics and semiconductor technology underline his status as a prominent inventor. With a wealth of patents and collaborative efforts, Topacio stands as an inspiring figure for aspiring inventors, showcasing how innovative ideas can lead to tangible advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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