The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Oct. 31, 2014
Applicants:
Roden Topacio, Springwater, CA;
Andrew KW Leung, Markham, CA;
Inventors:
Roden Topacio, Springwater, CA;
Andrew KW Leung, Markham, CA;
Assignee:
ATI Technologies ULC, Markham, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad.