Andrew Kw Leung

Title: The Innovative Contributions of Andrew Kw Leung

Introduction

Andrew Kw Leung is a notable inventor based in Markham, Canada. He has made significant contributions to the field of electronic packaging through his innovative patents. With a total of two patents to his name, Leung has demonstrated a commitment to advancing technology in circuit board manufacturing.

Latest Patents

Leung's latest patents include a "Circuit board with constrained solder interconnect pads" and a "Method of manufacturing substrates having asymmetric buildup layers." The first patent discloses various circuit boards and methods of manufacturing them. It includes a method that forms a solder mask on a circuit board with a first opening that has a sidewall, which sets the lateral extent of the solder interconnect pad. The second patent outlines a method for manufacturing a substrate for electronic packaging, which features a core with different numbers of buildup layers on each surface. This method protects the dielectric layer in each buildup layer from becoming overdesmeared during substrate manufacturing.

Career Highlights

Throughout his career, Andrew Kw Leung has worked with prominent companies such as ATI Technologies and Advanced Micro Devices Corporation. His experience in these organizations has contributed to his expertise in electronic packaging and circuit board technology.

Collaborations

Leung has collaborated with various professionals in his field, including Roden R Topacio and Liane Martinez. These collaborations have likely enriched his work and contributed to his innovative patents.

Conclusion

Andrew Kw Leung's contributions to the field of electronic packaging through his patents reflect his dedication to innovation. His work continues to influence the industry and showcases the importance of advancements in technology.