Ati Technologies Ulc

Advanced Micro Devices Corporation

Andrew Kw Leung

Roden R Topacio

Yip Seng Low

Liane Martinez

Yu-Ling Hsieh

Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad.

Circuit board with constrained solder interconnect pads

A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m&#x2260;n is disclosed. The method includes forming (m&#x2212;n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials.

Growing community of inventors

Markham, Canada

Andrew Kw Leung