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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8927344 B1

PDFFull Text
Date of Patent:
Jan. 06, 2015

Filed:

Nov. 08, 2012

Die substrate with reinforcement structure

Applicants:

Roden Topacio, Markham, CA;

Adam Zbrzezny, Warsaw, PL;

Inventors:

Roden Topacio, Markham, CA;

Adam Zbrzezny, Warsaw, PL;

Assignee:

ATI Technologies ULC, Markham, CA;

Attorney:

Timothy M. Honeycutt

Primary Examiner:

David Zarneke

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/31 (2006.01); H05K 1/02 (2006.01); H01L 23/16 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H05K 2201/09136 (2013.01); H01L 2924/15311 (2013.01); H05K 2203/043 (2013.01); H05K 3/3452 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/09781 (2013.01); H05K 1/0271 (2013.01); H05K 3/3457 (2013.01); H01L 23/16 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 23/562 (2013.01); H01L 2224/16 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.

Find Patent Forward Citations

Topacio, Roden. (2015). Die substrate with reinforcement structure (U.S. Patent No. 8927344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8927344

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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