The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Nov. 12, 2021
Ati Technologies Ulc, Markham, CA;
Jianguo Li, Markham, CA;
Roden Topacio, Markham, CA;
ATI TECHNOLOGIES ULC, Markham, CA;
Abstract
A semiconductor package assembly includes a semiconductor package that includes a semiconductor chip bonded to a substrate. The assembly also includes a plurality of passive devices mounted on a bottom surface of the substrate opposite the semiconductor chip, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices. The assembly also includes a plurality of solder structures attached to the bottom surface of the substrate. When mounted on a circuit board, the standoff passive devices prevent solder bridging.