Scarborough, Canada

Jianguo Li

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Scarborough, CA (2018 - 2022)
  • Markham, CA (2024)

Company Filing History:


Years Active: 2018-2024

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3 patents (USPTO):Explore Patents

Title: The Innovations of Jianguo Li

Introduction

Jianguo Li is a notable inventor based in Scarborough, Canada. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on enhancing the functionality and efficiency of semiconductor package assemblies.

Latest Patents

One of Jianguo Li's latest patents is titled "Semiconductor package assembly using a passive device as a standoff." This invention involves a semiconductor package that includes a semiconductor chip bonded to a substrate. The assembly features a plurality of passive devices mounted on the bottom surface of the substrate, which helps prevent solder bridging when mounted on a circuit board. Another significant patent is "Integrated circuit product customizations for identification code visibility." This apparatus includes a substrate with an identification code and a stiffener structure designed to expose the identification code, enhancing its visibility.

Career Highlights

Throughout his career, Jianguo Li has worked with prominent companies in the technology sector, including ATI Technologies and Advanced Micro Devices Corporation. His experience in these organizations has allowed him to develop innovative solutions in semiconductor technology.

Collaborations

Jianguo Li has collaborated with several professionals in his field, including Suming Hu and Roden R. Topacio. These collaborations have contributed to the advancement of his projects and patents.

Conclusion

Jianguo Li's contributions to semiconductor technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the field. His work continues to influence the industry and pave the way for future developments.

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