The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Aug. 05, 2014
Applicants:

Suming HU, North York, CA;

Neil Mclellan, Austin, TX (US);

Andrew K W Leung, Markham, CA;

Jianguo LI, Scarborough, CA;

Inventors:

Suming Hu, North York, CA;

Neil McLellan, Austin, TX (US);

Andrew K W Leung, Markham, CA;

Jianguo Li, Scarborough, CA;

Assignees:

ATI Technologies ULC, Markham, CA;

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01L 23/13 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H05K 3/0052 (2013.01); H01L 23/49816 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0746 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.


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