Suming Hu

Title: Suming Hu: Innovator in Semiconductor Technology

Introduction

Suming Hu is a prominent inventor based in North York, Canada, known for his significant contributions to semiconductor technology. With a total of seven patents to his name, he has made remarkable advancements in the field, particularly in the design and functionality of semiconductor chips.

Latest Patents

Among his latest patents, one notable invention is the "Semiconductor chip having stepped conductive pillars." This innovation features a semiconductor chip that includes a device layer and an interconnect layer, which is fabricated on the device layer. The interconnect layer comprises a conductive pad and a conductive pillar that is coupled to the pad. The design includes a first portion with a greater width than the second portion, enhancing the chip's performance. Another significant patent is the "Semiconductor chip with patterned underbump metallization and polymer film." This invention outlines various solder bump and underbump metallization structures, detailing a method that involves forming a first underbump metallization layer on a semiconductor chip, which is then covered with a polymer layer.

Career Highlights

Suming Hu has worked with notable companies in the technology sector, including ATI Technologies and Advanced Micro Devices Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout his career, Suming has collaborated with talented individuals such as Roden R. Topacio and Yip Seng Low. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Suming Hu's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a deep understanding of the complexities involved in semiconductor design, making him a key figure in this industry.