Andrew K W Leung

This inventor holds 6 USPTO granted patents. Top assignees: Advanced Micro Devices Corporation, Ati Technologies Ulc. Active years: 2011-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew K W Leung. Retrieved from https://idiyas.com/inventor/andrew-k-w-leung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 16(Granted Patents)

Company Filing History:

4 out of 13,168

Advanced Micro Devices Corporation

where one patent can have more than one assignee

Years Active: 2011-2018

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9867282 - Circuit board with corner hollows (2018-01-09),

2. 9793199 - Circuit board with via trace connection and method of making the same (2017-10-17),

3. 8772083 - Solder mask with anchor structures (2014-07-08),

4. 8445329 - Circuit board with oval micro via (2013-05-21),

5. 8294266 - Conductor bump method and apparatus (2012-10-23),

6. 7906424 - Conductor bump method and apparatus (2011-03-15),

Title: The Innovative Contributions of Andrew K W Leung

Introduction

Andrew K W Leung is a notable inventor based in Markham, Canada. He has made significant contributions to the field of circuit board technology, holding a total of 6 patents. His work has advanced the manufacturing processes and design of circuit boards, showcasing his expertise and innovative spirit.

Latest Patents

Among his latest patents is a method for manufacturing a circuit board with corner hollows. This invention involves singulating a circuit board from a substrate of multiple circuit boards, where the circuit board is uniquely shaped to feature four corner hollows. These hollows can take on various shapes, enhancing the design flexibility of circuit boards. Another notable patent is for a circuit board with via trace connection, which includes various circuit boards and methods of manufacturing. This method involves forming a first interconnect layer of a circuit board, which contains a first conductor trace with a segment that does not include a via land. A first via is then formed on this segment, further innovating circuit board design.

Career Highlights

Andrew has worked with prominent companies in the technology sector, including ATI Technologies and Advanced Micro Devices Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge projects in the electronics industry.

Collaborations

Throughout his career, Andrew has collaborated with talented individuals such as Neil McLellan and Yip Seng Low. These partnerships have fostered a creative environment that has led to the development of innovative technologies.

Conclusion

Andrew K W Leung's contributions to circuit board technology are significant and impactful. His patents reflect a commitment to innovation and excellence in the field. His career continues to inspire future inventors and engineers.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]