The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

Sep. 10, 2011
Applicants:

Andrew K W Leung, Markham, CA;

Roden R. Topacio, Markham, CA;

Yu-ling Hsieh, Xindian, TW;

Yip Seng Low, Thornhill, CA;

Inventors:

Andrew K W Leung, Markham, CA;

Roden R. Topacio, Markham, CA;

Yu-Ling Hsieh, Xindian, TW;

Yip Seng Low, Thornhill, CA;

Assignees:

ATI Technologies ULC, Markham, CA;

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.


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