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For the Inventor, By the Inventor

Toronto, Canada

Neil McLellan

This inventor holds 23 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Ati Technologies Ulc, Advanced Micro Devices Corporation. Active years: 2010-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Neil McLellan. Retrieved from https://idiyas.com/inventor/neil-mclellan-m566o1ej

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

 

Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 88(Granted Patents)


Location History:

  • Toronto, CA (2010 - 2017)
  • Austin, TX (US) (2012 - 2018)

Company Filing History:

goldMedal18 out of 1,121 
 
Ati Technologies Ulc
 patents
silverMedal11 out of 13,175 
 
Advanced Micro Devices Corporation
 patents
where one patent can have more than one assignee

Years Active: 2010-2018

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Areas of Expertise:
Circuit Board
Semiconductor Chip
Wafer Level Packaging
Thermal Management
Solder Structures
Underfill Anchors
Integrated Circuit
Die Stacking
Micro Via
Passive Devices
Conductor Bump
Metallization
23 patents (USPTO):Explore Patents
1. 9867282 - Circuit board with corner hollows (2018-01-09),
2. 9793199 - Circuit board with via trace connection and method of making the same (2017-10-17),
3. 9607935 - Semiconductor chip package with undermount passive devices (2017-03-28),
4. 9318457 - Methods of fabricating semiconductor chip solder structures (2016-04-19),
5. 9142520 - Methods of fabricating semiconductor chip solder structures (2015-09-22),
6. 8847383 - Integrated circuit package strip with stiffener (2014-09-30),
7. 8785317 - Wafer level packaging of semiconductor chips (2014-07-22),
8. 8704353 - Thermal management of stacked semiconductor chips with electrically non-functional interconnects (2014-04-22),
9. 8647974 - Method of fabricating a semiconductor chip with supportive terminal pad (2014-02-11),
10. 8633599 - Semiconductor chip with underfill anchors (2014-01-21),
11. 8564122 - Circuit board component shim structure (2013-10-22),
12. 8445329 - Circuit board with oval micro via (2013-05-21),
13. 8389340 - Methods of forming semiconductor chip underfill anchors (2013-03-05),
14. 8344505 - Wafer level packaging of semiconductor chips (2013-01-01),
15. 8314474 - Under bump metallization for on-die capacitor (2012-11-20),

Title: The Inventive Journey of Neil McLellan: Revolutionizing Circuit Board Technology

Introduction: Neil McLellan, a brilliant inventor based in Toronto, CA, has left a significant mark in the world of technology with his groundbreaking innovations in circuit board manufacturing. With a total of 23 patents to his name, McLellan continues to push the boundaries of what is possible in this ever-evolving industry.

Latest Patents: Among his latest patents is the "Circuit board with corner hollows", a method that involves singulating circuit boards from a substrate, shaped with unique corner hollows of various shapes. Additionally, McLellan's "Circuit board with via trace connection" introduces new methods of manufacturing circuit boards with intricate interconnect layers, including innovative conductor trace configurations.

Career Highlights: Neil McLellan has brought his innovative prowess to esteemed companies like ATI Technologies ULC and Advanced Micro Devices Corporation, where he has pioneered new techniques and technologies in circuit board design. His expertise and dedication have significantly contributed to the advancement of the industry.

Collaborations: Throughout his career, McLellan has collaborated with industry peers such as Roden R Topacio and Vincent K Chan. Together, they have combined their skills and insights to create cutting-edge solutions that have shaped the landscape of circuit board technology.

Conclusion: Neil McLellan's exceptional contributions to the field of circuit board innovation have established him as a trailblazer in the industry. His relentless pursuit of excellence and his willingness to push the boundaries of traditional methods have solidified his reputation as a visionary inventor with a knack for revolutionizing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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