The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Apr. 21, 2009
Applicants:

Liane Martinez, New Market, CA;

Neil Mclellan, Toronto, CA;

Silqun Leung, Richmond Hill, CA;

Gabriel Wong, Richmond Hill, CA;

Inventors:

Liane Martinez, New Market, CA;

Neil McLellan, Toronto, CA;

Silqun Leung, Richmond Hill, CA;

Gabriel Wong, Richmond Hill, CA;

Assignee:

ATI Technologies ULC, Markham, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H05K 1/0231 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/0562 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/15311 (2013.01); H05K 1/145 (2013.01); H05K 3/3442 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01);
Abstract

Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.


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