Silqun Leung

Title: Silqun Leung: Innovator in Semiconductor Technology

Introduction

Silqun Leung is a notable inventor based in Richmond Hill, Canada. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to chip packaging and capacitor integration.

Latest Patents

Leung's latest patents include a semiconductor chip package with undermount passive devices. This invention discloses various semiconductor chip packages that incorporate undermounted passive devices and methods for their manufacturing. The method involves coupling a semiconductor chip to a carrier substrate, where at least one passive device is coupled to the opposite side of the substrate. This design allows for efficient electrical coupling to a printed circuit board.

Another significant patent is for a semiconductor chip substrate with a multi-capacitor footprint. This invention outlines methods and apparatus for effectively coupling capacitors to a chip substrate. The process includes forming a mask on a semiconductor chip substrate with multiple conductor pads, allowing for precise placement of capacitor pads that correspond to the terminals of capacitors.

Career Highlights

Silqun Leung is currently employed at Ati Technologies ULC, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance and reliability of semiconductor devices.

Collaborations

Leung collaborates with talented professionals in his field, including coworkers Liane Martinez and Neil McLellan. Their combined expertise contributes to the innovative projects at Ati Technologies ULC.

Conclusion

Silqun Leung's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the development of advanced electronic components.