Liane Martinez

Title: Liane Martinez: Innovator in Semiconductor Technology

Introduction

Liane Martinez is a prominent inventor based in North York, Canada, known for her significant contributions to semiconductor technology. With a total of eight patents to her name, she has made remarkable advancements in the field, particularly in the design and manufacturing of semiconductor packages.

Latest Patents

One of her latest patents is titled "Automatic Redistribution Layer via Generation." This invention describes a system and method for automatically generating the placement of vias within redistribution layers of a semiconductor package. In this innovation, a user defines attributes for automatic via generation, which is executed by a processor in a computing device. The processor generates the placement of vias based on these attributes and the identification of overlapping regions between metal layers.

Another notable patent is "Semiconductor Chip Package with Undermount Passive Devices." This patent discloses various semiconductor chip packages that include undermounted passive devices. The manufacturing method involves coupling a semiconductor chip to a carrier substrate, with passive devices attached to the opposite side. This design allows for efficient electrical coupling to printed circuit boards.

Career Highlights

Liane has worked with several notable companies in the technology sector, including ATI Technologies and Advanced Micro Devices Corporation. Her experience in these organizations has contributed to her expertise in semiconductor design and innovation.

Collaborations

Throughout her career, Liane has collaborated with talented professionals, including Roden R. Topacio and Yip Seng Low. These partnerships have fostered a creative environment that has led to groundbreaking advancements in her field.

Conclusion

Liane Martinez is a trailblazer in semiconductor technology, with a strong portfolio of patents that reflect her innovative spirit. Her work continues to influence the industry, paving the way for future advancements in semiconductor design and manufacturing.